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BGA Solder Balls & Reballing Kit for PCB Repair

BGA Solder Balls & Reballing Kit for PCB Repair

Features: Eco-friendly lead-tin balls, bright and full solder joint, little smoke, no irritating smell. Strong weldin…
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R 33.00R 39.60
🚚 Ships in 16-18 work days

Features: Eco-friendly lead-tin balls, bright and full solder joint, little smoke, no irritating smell. Strong welding force, widely used in all kinds of electronic products. Easy to weld, no fal...

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Warranty
6-Month Limited Warranty.
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Return Policy
Hassle-Free Exchanges & Returns for 7 Days.

Product Information

SKU101351194
Stock StatusIn Stock
Safe Checkout
Features:



Eco-friendly lead-tin balls, bright and full solder joint, little smoke, no irritating smell.


Strong welding force, widely used in all kinds of electronic products.


Easy to weld, no false welding. 25000pcs/bottle for enough use.


Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm


Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultra-small ball type tin electronic parts.




Specification:

Material: tin

Solder flux content: 63%

Tin ball diameter: 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm (Optional)

Melting point: 183

Operating temperature: 200~380

Bottle size: 35mm / 1.4in (high ); 16mm / 0.6in (width)

Quantity: 25000pcs/bottle



Package List:

1Bottle x Soldering Ball



Note:

There are 25,000 pieces/bottle. The bottle size is fixed. The larger the diameter of the ball, the greater its load.

What's in the box
1 x Soldering Ball

Features:



Eco-friendly lead-tin balls, bright and full solder joint, little smoke, no irritating smell.


Strong welding force, widely used in all kinds of electronic products.


Easy to weld, no false welding. 25000pcs/bottle for enough use.


Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm


Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultra-small ball type tin electronic parts.




Specification:

Material: tin

Solder flux content: 63%

Tin ball diameter: 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm (Optional)

Melting point: 183

Operating temperature: 200~380

Bottle size: 35mm / 1.4in (high ); 16mm / 0.6in (width)

Quantity: 25000pcs/bottle



Package List:

1Bottle x Soldering Ball



Note:

There are 25,000 pieces/bottle. The bottle size is fixed. The larger the diameter of the ball, the greater its load.

What's in the box
1 x Soldering Ball

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