Wakefield Solutions (637-15ABEP) Heat Sink, 11 °C/W, TO-220

Wakefield Solutions (637-15ABEP) Heat Sink, 11 °C/W, TO-220

For Board Level Power Semiconductor, 34.9 mm, 38.1 mm, 12.7 mm
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R 93.80
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For Board Level Power Semiconductor, 34.9 mm, 38.1 mm, 12.7 mm

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6-Month Limited Warranty.
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Hassle-Free Exchanges & Returns for 7 Days.

Product Information

SKU91851408
Stock StatusIn Stock
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Heat Sink, For Board Level Power Semiconductor, 11 °C/W, TO-220, 34.9 mm, 38.1 mm, 12.7 mm

Product Information

Thermal Resistance: 11°C/W
Packages Cooled: TO-220
External Width - Metric: 34.9mm
External Height - Metric: 38.1mm
External Length - Metric: 12.7mm

Heat Sink Material: Aluminium
External Width - Imperial: 1.37"
External Height - Imperial: 1.5"
External Length - Imperial: 0.5"

Product Overview
The 637-15ABEP is a 38.1 x 34.9 x 12.7mm high-efficiency Heat Sink made of aluminium with black anodized finish. This board level heat sink features wave-solderable pins on 1-inch centre for vertical mounting on printed circuit boards. Use this heat sink where weight and board space occupied must be minimized.

Applications
Industrial

What's in the box
1 x Heat Sink

Heat Sink, For Board Level Power Semiconductor, 11 °C/W, TO-220, 34.9 mm, 38.1 mm, 12.7 mm

Product Information

Thermal Resistance: 11°C/W
Packages Cooled: TO-220
External Width - Metric: 34.9mm
External Height - Metric: 38.1mm
External Length - Metric: 12.7mm

Heat Sink Material: Aluminium
External Width - Imperial: 1.37"
External Height - Imperial: 1.5"
External Length - Imperial: 0.5"

Product Overview
The 637-15ABEP is a 38.1 x 34.9 x 12.7mm high-efficiency Heat Sink made of aluminium with black anodized finish. This board level heat sink features wave-solderable pins on 1-inch centre for vertical mounting on printed circuit boards. Use this heat sink where weight and board space occupied must be minimized.

Applications
Industrial

What's in the box
1 x Heat Sink