Heat Sink, For Board Level Power Semiconductor, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm

Product Information

Thermal Resistance: 3.8°C/W
Packages Cooled: TO-220
External Width - Metric: 41.9mm
External Height - Metric: 25.4mm
External Length - Metric: 25.4mm

Heat Sink Material: Aluminium
External Width - Imperial: 1.65"
External Height - Imperial: 1"
External Length - Imperial: 1"

Product Overview
The 647-10-ABEP is a 25.4mm high-performance board level power semiconductor Heat Sink with aluminium, black anodized, 3.8°C/W thermal resistance. This heat sink features wave-solderable pins on 1-inch centres for vertical mounting of larger devices on printed circuit boards.

Applications
HVAC

What's in the box
1 x Heat Sink