Boyd (573300D00010G) Heat Sink, Square, PCB, 18 °C/W

Heat Sink, Square, PCB, For D-Pak Devices, 18 °C/W, TO-263, 12.7 mm, 10.16 mm, 26.16 mm

Product Information

Thermal Resistance: 18°C/W
Packages Cooled: TO-263
External Width – Metric: 12.7mm
External Height – Metric: 10.16mm
External Length – Metric: 26.16mm

Heat Sink Material: Copper
External Width – Imperial: 0.5″
External Height – Imperial: 0.4″
External Length – Imperial: 1.03″

Product Overview
The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.
Horizontal mount orientation

Applications
Motor Drive & Control, Medical, Industrial, Communications & Networking, Power Management, Consumer Electronics

What’s in the box
1 x Heat Sink