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Boyd (374324B00035G) Heat Sink, Square, PCB, 30.6 °C/W
Boyd (374324B00035G) Heat Sink, Square, PCB, 30.6 °C/W

Boyd (374324B00035G) Heat Sink, Square, PCB, 30.6 °C/W

For Ball Grid Arrays, BGA, 27 mm, 10 mm, 27 mm
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R 100.71
🚚 Ships in 9-11 work days

For Ball Grid Arrays, BGA, 27 mm, 10 mm, 27 mm

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Warranty
6-Month Limited Warranty.
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Return Policy
Hassle-Free Exchanges & Returns for 7 Days.

Product Information

SKU91859523
Stock StatusIn Stock
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Interest Rate0% Interest
Payment Period6 months
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Heat Sink, Square, PCB, For Ball Grid Arrays, 30.6 °C/W, BGA, 27 mm, 10 mm, 27 mm

Product Information

Thermal Resistance: 30.6°C/W
Packages Cooled: BGA
External Width - Metric: 27mm
External Height - Metric: 10mm
External Length - Metric: 27mm

Heat Sink Material: Aluminium
External Width - Imperial: 1.06"
External Height - Imperial: 0.39"
External Length - Imperial: 1.06"

Product Overview
Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin-Fin array allows omni-directional airflow to maximize heat dissipation
Fin dimensions (LxW): 13x12mm

What's in the box
1 x Heat Sink

Heat Sink, Square, PCB, For Ball Grid Arrays, 30.6 °C/W, BGA, 27 mm, 10 mm, 27 mm

Product Information

Thermal Resistance: 30.6°C/W
Packages Cooled: BGA
External Width - Metric: 27mm
External Height - Metric: 10mm
External Length - Metric: 27mm

Heat Sink Material: Aluminium
External Width - Imperial: 1.06"
External Height - Imperial: 0.39"
External Length - Imperial: 1.06"

Product Overview
Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin-Fin array allows omni-directional airflow to maximize heat dissipation
Fin dimensions (LxW): 13x12mm

What's in the box
1 x Heat Sink

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