Heat Sink, For Board Level Power Semiconductor, 5.8 °C/W, TO-220, 34.9 mm, 25.4 mm, 12.7 mm

Product Information

Thermal Resistance: 5.8°C/W
Packages Cooled: TO-220
External Width - Metric: 34.9mm
External Height - Metric: 25.4mm
External Length - Metric: 12.7mm

Heat Sink Material: Aluminium
External Width - Imperial: 1.37"
External Height - Imperial: 1"
External Length - Imperial: 0.5"

Product Overview
The 637-10ABEP is a 12.7mm power semiconductor Heat Sink with aluminium construction, black anodized finish, 5.8°C/W thermal resistance. This heat sink features wave-solderable pins on 1-inch centres for vertical mounting on printed circuit boards. Use this heat sink where weight and board space occupied is minimized.

High efficiency
Board level

Applications
HVAC

What's in the box
1 x Heat Sink