Heat Sink, For Ball Grid Array, Push-Pin, 10.5 °C/W, BGA, 49 mm, 10 mm, 49 mm
Product Information
Thermal Resistance: 10.5°C/W
Packages Cooled: BGA
External Width – Metric: 49mm
External Height – Metric: 10mm
External Length – Metric: 49mm
Heat Sink Material: Aluminium
External Width – Imperial: 1.93″
External Height – Imperial: 0.39″
External Length – Imperial: 1.93″
Product Overview
The BGA-PP-015 is a 49 x 49 x 10mm push-pin Heat Sink with thermal tape. This heat sink is made of aluminium and natural anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array.
Applications
Industrial
What’s in the box
1 x Heat Sink
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