Relife Bga/Ic High-Effect Adhesive Remove Liquid Rl-039 20ml

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Relife BGA/IC High-Effect Adhesive Remove Liquid RL-039 (20ml)

Relife BGA/IC High-Effect Adhesive Remove Liquid RL-039 is a powerful solution specifically formulated for the safe and effective removal of adhesives used in Ball Grid Array (BGA) and Integrated Circuit (IC) applications. This 20ml liquid is designed to streamline the repair and maintenance of electronic components by ensuring precise adhesive removal without damaging sensitive parts.

Key Features:

High Efficiency: Formulated to quickly dissolve and break down strong adhesives, making it ideal for BGA and IC chip removal.
Gentle on Components: Safe for use on various electronic substrates, minimizing the risk of damage to delicate circuits and pads.
Easy Application: Comes with a user-friendly dropper for precise application, allowing for targeted removal in tight spaces.
Fast Acting: Begins working immediately upon application, reducing downtime during repair processes.
Versatile Use: Suitable for a wide range of electronic repair tasks, making it an essential tool for technicians and hobbyists alike.
Applications: Perfect for electronics repair, rework stations, and DIY projects, Relife RL-039 is a must-have for anyone dealing with BGA and IC components. Ensure efficient repairs and maintain the integrity of your electronics with this reliable adhesive removal solution.

What’s in the box
1 x adhesive Remover Liquid